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DAC7802LP Scheda tecnica(PDF) 16 Page - Texas Instruments

Il numero della parte DAC7802LP
Spiegazioni elettronici  Dual Monolithic CMOS 12-Bit Multiplying DIGITAL-TO-ANALOG CONVERTERS
PDF  17 Pages
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Produttore elettronici  TI [Texas Instruments]
Homepage  http://www.ti.com
Logo TI - Texas Instruments

DAC7802LP Scheda tecnica(HTML) 16 Page - Texas Instruments

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DAC7800, 7801, 7802
16
SBAS005A
www.ti.com
PACKAGE DRAWINGS (Cont)
MPDI066 – AUGUST 2001
NTG (R-PDIP-T24)
PLASTIC DUAL-IN-LINE
4202642/A 08/01
0.150 (3,81)
0.115 (2,92)
–C–
0.005 (0,13) MIN
1/2 Lead 4 PL
11
2
13
24
1.195 (30,35)
1.160 (29,46)
0.240 (6,10)
0.280 (7,11)
0.070 (1,78)
0.045 (1,14)
0.030 (0,76)
0.045 (1,14)
0.014 (0,36)
0.022 (0,56)
0.010 (0,25) M
C
0.210 (5,33)
0.195 (4,95)
0.115 (2,92)
0.300 (7,62)
MAX
0.430 (10,92)
0.000 (0,00)
0.060 (1,52)
0.014 (0,36)
0.008 (0,20)
0.325 (8,26)
0.300 (7,62)
Index
Area
0.015 (0,38)
MIN
0.100 (2,54)
Seating Plane
Base Plane
MAX
C
C
C
E
F
F
D
D
H
H
D
E
4 PL
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Dimensions are measured with the package
seated in JEDEC seating plane gauge GS-3.
D. Dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 (0,25).
E. Dimensions measured with the leads constrained to be
perpendicular to Datum C.
F. Dimensions are measured at the lead tips with the
leads unconstrained.
G. Pointed or rounded lead tips are preferred to ease
insertion.
H. Maximum dimensions do not include dambar
protrusions. Dambar protrusions shall not exceed
0.010 (0,25).
I. Distance between leads including dambar protrusions
to be 0.005 (0,13) minumum.
J. A visual index feature must be located within the
cross–hatched area.
K. For automatic insertion, any raised irregularity on the
top surface (step, mesa, etc.) shall be symmetrical
about the lateral and longitudinal package centerlines.
L. Controlling dimension in inches.
M. Falls within JEDEC MS-011-AB.



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