Motore di ricerca datesheet componenti elettronici
  Italian  ▼
ALLDATASHEETIT.COM

X  

Preview PDF HTML

MPX2100 Scheda tecnica(PDF) 5 Page - Freescale Semiconductor, Inc

Il numero della parte MPX2100
Spiegazioni elettronici  100 kPa On-Chip Temperature Compensated and Calibrated Silicon Pressure Sensors
PDF  10 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Produttore elettronici  FREESCALE [Freescale Semiconductor, Inc]
Homepage  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MPX2100 Scheda tecnica(HTML) 5 Page - Freescale Semiconductor, Inc

  MPX2100_08 Datasheet HTML 1Page - Freescale Semiconductor, Inc MPX2100_08 Datasheet HTML 2Page - Freescale Semiconductor, Inc MPX2100_08 Datasheet HTML 3Page - Freescale Semiconductor, Inc MPX2100_08 Datasheet HTML 4Page - Freescale Semiconductor, Inc MPX2100_08 Datasheet HTML 5Page - Freescale Semiconductor, Inc MPX2100_08 Datasheet HTML 6Page - Freescale Semiconductor, Inc MPX2100_08 Datasheet HTML 7Page - Freescale Semiconductor, Inc MPX2100_08 Datasheet HTML 8Page - Freescale Semiconductor, Inc MPX2100_08 Datasheet HTML 9Page - Freescale Semiconductor, Inc Next Button
Zoom Inzoom in Zoom Outzoom out
 5 / 10 page
background image
MPX2100
Sensors
Freescale Semiconductor
5
Pressure
On-Chip Temperature Compensation and Calibration
Figure 3 shows the output characteristics of the
MPX2100 series at 25
°C. The output is directly proportional
to the differential pressure and is essentially a straight line.
The effects of temperature on Full-Scale Span and Offset
are very small and are shown under Operating
Characteristics.
Figure 3. Output versus Pressure Differential
Figure 4. Cross-Sectional Diagram (not to scale)
Figure 4 illustrates the absolute sensing configuration
(right) and the differential or gauge configuration in the basic
chip carrier (Case 344). A silicone gel isolates the die surface
and wire bonds from the environment, while allowing the
pressure signal to be transmitted to the silicon diaphragm.
The MPX2100 series pressure sensor operating
characteristics and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media
other than dry air may have adverse effects on sensor
performance and long term reliability. Contact the factory for
information regarding media compatibility in your application.
kPa
PSI
40
35
30
25
15
10
5
0
-5
025
3.62
50
7.25
75
10.87
100
14.5
Offset
(Typ)
20
MAX
TYP
MIN
VS = 10 Vdc
TA = 25°C
P1 > P2
Span
Range
(Typ)
Silicone Gel
Die Coat
Absolute
Die
P1
Metal Cover
Epoxy
Case
Absolute Element
P2
Lead Frame
Wire Bond
Die
Bond
Stainless Steel
Lead Frame
Wire Bond
Differential/Gauge
Die
Silicone Gel
Die Coat
Differential/Gauge
P2
Die
Bond
Epoxy
Case
Stainless Steel
Metal Cover
P1
Element



Html Pages

1 2 3 4 5 6 7 8 9 10


Scheda tecnica Scarica

Go To PDF Page


Link URL



Lei ha avuto il aiuto da alldatasheet?  [ DONATE ] 

Di alldatasheet   |   Richest di pubblicita   |   contatti   |   Privacy Policy   |   Collegamento alla scheda tecnica    |   scambio Link   |   Ricerca produttore
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com