EMP310

UPDATED 05/08/2008

21.0 – 24.0 GHz Power Amplifier MMIC

Specifications are subject to change without notice.

Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085

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Revised May 2008

ASSEMBLY DRAWING

The length of RF wires should be as short as possible. Use at least two wires between RF pad and

50 ohm line and separate the wires to minimize the mutual inductance.

CHIP OUTLINE

Chip Size 1000 x 2250 microns

Chip Thickness: 75

± 13 microns

PAD Dimensions: 100 x 100 microns

All Dimensions in Microns