SUPERWORLD ELECTRONICS (S) PTE LTD

NOTE : Specifications subject to change without notice. Please check our website for latest information.

PG. 6

15.01.2008

L816PW SERIES

10. RELIABILITY AND TEST CONDITION :

Electrical Characteristics Test

cooling

260°C

1. Appearance : No damage

2. Inductance : Within ±20% of initial value.

No disconnection or short circuit.

Humidity Resistance

1. Appearance : No damage

2. Inductance : Within ±20% of initial value.

No disconnection or short circuit.

Life Test

Thermal Shock

Low Temperature

Life Test

High Temperature

Reliability Test

Times (min.)

Temperature (°C)

Step

30±3

Within 3

Within 3

30±3

Measure at room temperature after placing for 2 to 3 hrs.

Measure at room temperature after placing for 2 to 3 hrs.

Humidity : 90% to 95%

Applied Current : Rated Curent

Time : 500±12 hours

Temperature : 40±5°C

Room Temperature

Room Temperature

Total : 5 cycles

3

4

2

1

+125±3

-55±3

Measure at room temperature after placing for 2 to 3 hrs.

Measure at room temperature after placing for 2 to 3 hrs.

Time : 500±12 hours

Time : 500±12 hours

Temperature : -55±5°C

Conditions of 1 cycle.

Temperature : 125±5°C

60

seconds

150°C

10±0.5

seconds

2. Inductance change : Within ±20%

1. Appearance : No significant abnormality

Solder Heat Resistance

Refer to standard electrical characteristics list

More than 90% of the terminal electrode

should be covered with solder.

Solderability Test

Mechanical Performance Test

Saturation Current (Isat)

Heat Rated Current (Irms)

DCR

Inductance

Flux for lead free : rosin

Preheating

Flux for lead free : rosin

Solder Temperature : 260±5°C

Solder : Sn99.95-Cu0.05

Preheat : 150°C, 60sec.

Dip Time : 10±0.5sec.

Dipping

Natural

Preheating

60

seconds

Dip Time : 4±1sec.

230°C

150°C

cooling

4±1

seconds

Dipping

Natural

Irms(A) will cause the coil temperature rise

approximately

T=40°C without core loss

HP4284A, CH11025, CH3302, CH1320, CH1320S

CH16502, Agilent33420A Micro-Ohm Meter.

Isat(A) will cause Lo to drop approximately 20%

2. Temperature measured by digital surface thermometer

Solder Temperature : 230±5°C

Preheat : 150°C, 60sec.

Solder : Sn99.95-Cu0.05

1. Applied the allowed DC current

LCR meter.

ITEM

PERFORMANCE

TEST CONDITION

HIGH CURRENT MOLDED POWER INDUCTORS