TL3116, TL3116Y

ULTRAFAST LOW POWER

PRECISION COMPARATORS

SLCS132C − MARCH 1997 − REVISED MAY 1997

2

POST OFFICE BOX 655303

TL3116Y chip information

This chip, when properly assembled, displays characteristics similar to the TL3116C. Thermal compression or

ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive

epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 10 MILS TYPICAL

BONDING PADS: 4

× 4 MILS MINIMUM

TJ max = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

TERMINALS 1 AND 6 CAN BE

CONNECTED TO MULTIPLE PADS.

Q OUT

IN−

IN+

LATCH ENABLE

Q OUT

(5)

(2)

(3)

(1)

(6)

VCC+

GND

(7)

(8)

+

−

VCC −

(4)

55

63

(1)

(4)

(3)

(2)

(5)

(1)

(1)

(8)

(7)

(6)

(6)

(6)

COMPONENT COUNT

Bipolars

53

MOSFETs

49

Resistors

46

Capacitors

14