TPIC0107B

PWM CONTROL INTELLIGENT H-BRIDGE

SLIS067 – NOVEMBER 1998

13

POST OFFICE BOX 655303

MECHANICAL DATA

DWP (R-PDSO-G**)

PowerPAD

™ PLASTIC SMALL-OUTLINE PACKAGE

Gage Plane

0.419 (10,65)

0.400 (10,16)

0.010 (0,25) NOM

Thermal Pad

(See Note D)

0.010 (0,25)

0.016 (0,40)

0.050 (1,27)

Seating Plane

4147575/A 02/98

11

10

A

20-PIN SHOWN

20

1

0.104 (2,65) MAX

0.293 (7,45)

0.299 (7,59)

0.020 (0,51)

0.014 (0,35)

0.004 (0,10)

M

0.010 (0,25)

0.050 (1,27)

0

°–8°

0.710

28

0.510

20

0.610

24

0.700

(18,03)

(17,78)

0.500

(15,49)

(15,24)

0.600

0.410

16

DIM

PINS **

(10,41)

(10,16)

0.400

A MIN

A MAX

(12,95)

(12,70)

0.006 (0,15)

0.002 (0,05)

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).

D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane. This pad is electrically

and thermally connected to the backside of the die and possibly selected leads.

PowerPAD is a trademark of Texas Instruments Incorporated.