TPS2205

DUAL-SLOT PC CARD POWER-INTERFACE SWITCH

FOR PARALLEL PCMCIA CONTROLLERS

SLVS128D OCTOBER 1995 – REVISED JUNE 1998

27

POST OFFICE BOX 655303

MECHANICAL DATA

DAP (R-PDSO-G**)

PowerPAD

™ PLASTIC SMALL-OUTLINE PACKAGE

0,25

0,75

0,50

0,15 NOM

Gage Plane

NOM

6,20

8,40

7,80

Thermal Pad

(see Note D)

38

12,60

11,10

32

Seating Plane

12,40

10,90

4073257/A 07/96

20

0,19

19

A

0,30

38

1

9,80

28

A MAX

PINS **

9,60

A MIN

DIM

1,20 MAX

10,90

11,10

30

38-PIN SHOWN

0,10

0,65

M

0,13

0

°–8°

0,15

0,05

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions include mold flash or protrusion.

D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane. This solderable pad

is electrically and thermally connected to the backside of the die and possiblly selected leads. The maximum pad size on the printed

circult board should be equal to the package body size (2,0 mm).

PowerPAD is a trademark of Texas Instruments Incorporated.