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CXG7003FN Scheda tecnica(PDF) 9 Page - Sony Corporation |
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CXG7003FN Scheda tecnica(HTML) 9 Page - Sony Corporation |
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9 / 9 page ![]() – 9 – CXG7003FN SONY CODE EIAJ CODE JEDEC CODE PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING COPPER ALLOY PACKAGE STRUCTURE 0.06g HSOF-26P-01 HSOF 26PIN (PLASTIC) B 0.4 0.07 M ∗5.6 ± 0.05 1 13 14 26 A S A S 0.9 ± 0.1 0.08 S 0.2 4.4 0.2 4.2 5.5 NOTE: Dimension “ ∗” does not include mold protrusion. 0.14 – 0.03 DETAIL B 0.2 ± 0.05 Solder Plating + 0.05 LEAD PLATING SPECIFICATIONS ITEM LEAD MATERIAL COPPER ALLOY SOLDER COMPOSITION Sn-Bi Bi:1-4wt% PLATING THICKNESS 5-18µm SPEC. Sony Corporation Package Outline Unit: mm |
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