Picor Corporation • www.picorpower.com

QPI-11 Data Sheet Rev. 1.6 Page 2 of 5

Pins

Parameter

Notes

Min

Max

Units

Bus+ to Bus–

Input voltage

Continuous

-50

50

Vdc

Bus+ to Bus–

Input voltage

100 ms transient

-100

100

Vdc

BUS+ / BUS– to shield plane

BUS inputs to shield hipot

-750

750

Vdc

QPI+ to QPI–

Input to output current

Continuous @ 25°C

7

Adc

Package

Power dissipation

@ 25°C

1.50

W

Package

Operating temperature

PCB to filter interface

100

°C

Package

Thermal resistance

Free air

75

°C/W

Package

Thermal resistance

PCB Layout Fig. 5

30

°C/W

Package

Storage temperature

-55

125

°C

Package

Reflow temperature

20 s exposure

(1)

212

°C

All Pins

ESD

HBM

-2

+2

kV

Parameter

Notes

Min

Typ

Max

Units

Bus+ to Bus- input range

Measured at 7 A

5

50

Vdc

Bus+ to Out+ voltage drop

Measured at 7 A

(2)

110

mVdc

Bus- to Out- voltage drop

Measured at 7 A

(2)

110

mVdc

Common mode attenuation

VBUS = 24 V Frequency = 1.0 MHz

50

dB

Differential mode attenuation

VBUS = 24 V Frequency = 1.0 MHz

70

dB

Input bias current at 40 V

Input current from Bus+ to Bus-

10

µA

Note 1: RoHS compliant product maximum peak temperature is 245°C for 20 seconds.

0.1000

Pad Detail: 10 Places

0.184

0.052

0.148

0.000

0.184

0.1773

0.4882

0.2000

0.9843

0.1000

0.2000

1

2

3

4

5

6

78

9

10

1/2 SIP Package

(Bottom View)

Pad Description

SiP Package Outline

Pin

Number

Name

Description

8, 9

Bus +

Positive bus voltage

1, 10

Bus –

Negative bus potential

6, 7

Out +

Positive input to the converter

4, 5

Out –

Negative input to the converter

2, 3

Shield

The shield connects to system shield and

may connect to the converter created

shield plane

Note 2: See Figure 6 for current derating curve.

Ordering Information

Part

Number

Description

QPI-11LZ

QPI-11 LGA Package, RoHS Compliant

QPI-11LZ-01

QPI-11 LGA, RoHS Compliant

Open Frame Package