MA4FCP200

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Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

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Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

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2

Flip Chip PIN Diode

Rev. V3

1. Total capacitance is equivalent to the sum of junction capacitance, Cj, plus the die parasitic capacitance, Cp.

junction, Rj.

3. Rs and Cp measured on an HP4291A with die mounted in an ODS-186 package.

4. Steady-state Thermal Resistance measured with die mounted in an ODS-186 package.

ESD

These devices very susceptible to ESD and are rated Class 0 (0-199V) per HBM MIL-STD-883, method 3015.7

[C = 100pF ±10%, R = 1.5kW ±1%]. Even though tested die pass 100V ESD, they must be handled in a

static-free environment.

Parameters @ Conditions

Symbol

Units

Min.

Typ.

Max.

pF

——

0.025

0.030

pF

——

0.020

——

Ω

——

2.4

3.0

Ω

——

2.8

——

Forward Voltage @ +100mA

V

——

1.25

1.5

Reverse Voltage @ -10μA

V

50

——

——

Reverse Current @ -50V

μA

——

——

10

nS

——

100

——

θ

°C/W

——

900

——

186