MCP633T-ESLASHMF datasheet(29/42 Pages) MICROCHIP

29 / 42 page

DS22197A-page 29

MCP631/2/3/5

6.0

PACKAGING INFORMATION

6.1

Package Marking Information

Legend: XX...X

Customer-specific information

Year code (last digit of calendar year)

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

NNN

Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

This package is Pb-free. The Pb-free JEDEC designator (

)

can be found on the outer packaging for this package.

Note:

In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

8-Lead SOIC (150 mil) (MCP631, MCP632, MCP633)

Example

XXXXXXXX

XXXXYYWW

NNN

MCP631E

0931

256

8-Lead DFN (3×3) (MCP632)

Example

Device

Code

MCP632

DABM

Note:

Applies to 8-Lead 3x3 DFN

10-Lead MSOP (MCP635)

Example

635EUN

931256

XXXXXX

YWWNNN

10-Lead DFN (3×3) (MCP635)

Example

Device

Code

MCP635

BAFB

Note:

Applies to 10-Lead 3x3 DFN

XXXX

YYWW

NNN

DABM

0931

256

XXXX

YYWW

NNN

BAFB

0931

256

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