ADG1606 datasheet(21/24 Pages) AD

21 / 24 page

ADG1606/ADG1607

Rev. 0 | Page 21 of 24

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-153-AE

8°

0°

SEATING

PLANE

COPLANARITY

0.10

1.20 MAX

6.40 BSC

0.65

BSC

PIN 1

0.30

0.19

0.20

0.09

4.50

4.40

4.30

0.75

0.60

0.45

9.80

9.70

9.60

0.15

0.05

Figure 37. 28-Lead Thin Shrink Small Outline Package [TSSOP]

(RU-28)

Dimensions shown in millimeters

COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2

0.30

0.23

0.18

0.20 REF

0.80 MAX

0.65 TYP

0.05 MAX

0.02 NOM

12° MAX

1.00

0.85

0.80

SEATING

PLANE

COPLANARITY

0.08

0.50

0.40

0.30

3.50 REF

0.50

BSC

PIN 1

INDICATOR

TOP

VIEW

5.00

BSC SQ

4.75

BSC SQ

3.25

3.10 SQ

2.95

PIN 1

INDICATOR

0.60 MAX

0.25 MIN

EXPOSED

PAD

(BOTTOM VIEW)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 38. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

5 mm × 5 mm Body, Very Thin Quad

(CP-32-2)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

ADG1606BRUZ1

−40°C to +125°C

28-Lead Thin Shrink Small Outline Package [TSSOP]

RU-28

ADG1606BRUZ-REEL71

−40°C to +125°C

28-Lead Thin Shrink Small Outline Package [TSSOP]

RU-28

ADG1606BCPZ-REEL71

−40°C to +125°C

32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-32-2

ADG1607BRUZ1

−40°C to +125°C

28-Lead Thin Shrink Small Outline Package [TSSOP]

RU-28

ADG1607BRUZ-REEL71

−40°C to +125°C

28-Lead Thin Shrink Small Outline Package [TSSOP]

RU-28

ADG1607BCPZ-REEL71

−40°C to +125°C

32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-32-2

1 Z = RoHS Compliant Part.

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