Heat Removal

With adequate airflow, no external heat sinking is need-

ed under most operating conditions. If excess heat

must be dissipated through the exposed pad, solder it

to circuit board copper. The exposed pad must be

Power Minimization

To minimize power consumption, activate only the

needed channels. Each channel placed in low-leakage

mode saves approximately 240mW.

Chip Information

PROCESS: BiCMOS

Quad, Ultra-Low-Power, 300Mbps ATE

Drivers/Comparators

20

______________________________________________________________________________________

SCLK

CS

DIN

D11

D10

D9

D4

D3

D1

D0

D2

MAX9972

LD

*FIRST BIT SHIFTED IN DURING WORD WRITE.

Figure 5. Serial-Interface Timing