Copyright

© ANPEC Electronics Corp.

Rev. A.10 - Oct., 2009

APL5912

www.anpec.com.tw

2

Ordering and Marking Information

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which

are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for

MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen

free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by

weight).

Package Code

KA : SOP-8P

Operating Ambient Temperature Range

Handing Code

TR : Tape & Reel

Assembly Material

G : Halogen and Lead Free Device

APL5912

Handling Code

Temperature Range

Package Code

APL5912

XXXXX

APL5912 KA :

XXXXX - Date Code

Assembly Material

Symbol

Parameter

Rating

Unit

VCNTL Supply Voltage (VCNTL to GND)

-0.3 ~ 7

V

VIN Supply Voltage (VIN to GND)

-0.3 ~ 3.3

V

EN and FB to GND

V

POK to GND

-0.3 ~ 7

V

Power Dissipation

3

W

Junction Temperature

150

Storage Temperature

-65 ~ 150

Maximum Lead Soldering Temperature, 10 Seconds

260

Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Thermal Characteristics

Symbol

Parameter

Typical Value

Unit

θ

JA

Junction-to-Ambient Thermal Resistance in Free Air

(Note 2)

SOP-8P

40

θ

JC

Junction-to-Case Thermal Resistance

(Note 3)

SOP-8P

17

Note 2:

θ

of SOP-8P is soldered directly on the PCB.

Note 3: The “Thermal Pad Temperature” is measured on the PCB copper area connected to the thermal pad of package.

1

2

3

4

8

7

6

5

VIN

Measured Point

PCB Copper