LA112B-G.A-R1-PF datasheet(7/7 Pages) LIGITEK

7 / 7 page

LIGITEK ELECTRONICS CO.,LTD.

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MIL-STD-202: 208D

MIL-STD-750: 2026

MIL-STD-883: 2003

JIS C 7021: A-2

1.T.Sol=230

℃±5℃

2.Dwell time=5

±1sec

Solderability Test

This test intended to see soldering well

performed or not.

MIL-STD-750: 1026

MIL-STD-883: 1005

JIS C 7021: B-1

MIL-STD-883:1008

JIS C 7021: B-10

MIL-STD-202:103B

JIS C 7021: B-11

MIL-STD-202: 107D

MIL-STD-750: 1051

MIL-STD-883: 1011

JIS C 7021: B-12

MIL-STD-202: 210A

MIL-STD-750: 2031

JIS C 7021: A-1

The purpose of this is the resistance of

the device which is laid under ondition

of high temperature for hours.

High Temperature

Storage Test

1.Ta=105

℃±5℃

2.t=1000 hrs (-24hrs, +72hrs)

1.Ta=-40

℃±5℃

2.t=1000 hrs (-24hrs, +72hrs)

1.Ta=105

℃±5℃&-40℃±5℃

(10min) (10min)

2.total 10 cycles

1.Ta=65

℃±5℃

2.RH=90 %~95%

3.t=240hrs

±2hrs

1.T.Sol=260

℃±5℃

2.Dwell time= 10

±1sec.

Thermal Shock Test

Solder Resistance

Test

High Temperature

High Humidity Test

Low Temperature

Storage Test

The purpose of this is the resistance of

the device to sudden extreme changes

in high and low temperature.

This test intended to determine the

thermal characteristic resistance

of the device to sudden exposures

at extreme changes in temperature

when soldering the lead wire.

The purpose of this test is the resistance

of the device under tropical for hous.

The purpose of this is the resistance

of the device which is laid under

condition of low temperature for hours.

Test Condition

1.Under Room Temperature

2.If=20mA

3.t=1000 hrs (-24hrs, +72hrs)

Reliability Test:

Test Item

Operating Life Test

PART NO. LA112B/G.A/R1-PF

This test is conducted for the purpose

of detemining the resisance of a part

in electrical and themal stressed.

Description

Reference

Standard

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