APT75DF170HJ

www.microsemi.com

2- 3

Electrical Characteristics

Symbol

Characteristic

Test Conditions

Min

Typ

Max

Unit

1.8

2.2

Diode Forward Voltage

1.9

V

250

Maximum Reverse Leakage Current

500

µA

Dynamic Characteristics

Symbol

Characteristic

Test Conditions

Min

Typ

Max

Unit

385

Reverse Recovery Time

490

ns

19

Reverse Recovery Charge

31

µC

9

Reverse Recovery Energy

di/dt = 800A/µs

18

mJ

Thermal and package characteristics

Symbol

Characteristic

Min

Typ

Max

Unit

Junction to Case Thermal resistance

0.5

Junction to Ambient

20

°C/W

RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz

2500

V

Storage Temperature Range

-55

150

Max Lead Temp for Soldering:0.063” from case for 10 sec

300

°C

Torque

1.5

N.m

Wt

Package Weight

29.2

g

SOT-227 (ISOTOP

31.5 (1.240)

31.7 (1.248)

Dimensions in Millimeters and (Inches)

7.8 (.307)

8.2 (.322)

30.1 (1.185)

30.3 (1.193)

38.0 (1.496)

38.2 (1.504)

14.9 (.587)

15.1 (.594)

11.8 (.463)

12.2 (.480)

8.9 (.350)

9.6 (.378)

Hex Nut M4

(4 places)

0.75 (.030)

0.85 (.033)

12.6 (.496)

12.8 (.504)

25.2 (0.992)

25.4 (1.000)

1.95 (.077)

2.14 (.084)

r = 4.0 (.157)

(2 places)

4.0 (.157)

4.2 (.165)

(2 places)

W=4.1 (.161)

W=4.3 (.169)

H=4.8 (.187)

H=4.9 (.193)

(4 places)

3.3 (.129)

3.6 (.143)

3.30 (.130)

4.57 (.180)