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LSR3330/T Scheda tecnica(PDF) 5 Page - LIGITEK electronics co., ltd. |
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LSR3330/T Scheda tecnica(HTML) 5 Page - LIGITEK electronics co., ltd. |
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5 / 5 page ![]() MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec Solderability Test This test intended to see soldering well performed or not. Reliability Test: MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.Ta=105 ℃±5℃&-40℃±5℃ (10min) (10min) 2.total 10 cycles Thermal Shock Test Solder Resistance Test High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. The purpose of this test is the resistance of the device under tropical for hous. Test Condition 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) High Temperature Storage Test Test Item Operating Life Test The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. Description This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. Reference Standard LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSR3330/T Page 4/4 |
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