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Motore di ricerca datesheet componenti elettronici |
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Motore di ricerca datesheet componenti elettronici |
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BAS40 Scheda tecnica(PDF) 18 Page - NXP Semiconductors |
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BAS40 Scheda tecnica(HTML) 18 Page - NXP Semiconductors |
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18 / 21 page  BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 08 — 13 January 2010 18 of 21 NXP Semiconductors BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes Fig 28. Reflow soldering footprint SOT416 Reflow soldering is the only recommended soldering method. Fig 29. Reflow soldering footprint SOT666 solder resist occupied area solder lands solder paste Dimensions in mm msa438 2.0 0.6 (3x) 0.7 1.5 1 2 3 1.1 2.2 0.5 (3x) 0.85 0.6 1.9 solder lands placement area occupied area solder paste sot666_fr 2.75 2.45 2.1 1.6 0.4 (6 ×) 0.55 (2 ×) 0.25 (2 ×) 0.6 (2 ×) 0.65 (2 ×) 0.3 (2 ×) 0.325 (4 ×) 0.45 (4 ×) 0.5 (4 ×) 0.375 (4 ×) 1.7 2 1.7 1.075 0.538 Dimensions in mm |
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