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BAS70 Scheda tecnica(PDF) 11 Page - NXP Semiconductors |
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BAS70 Scheda tecnica(HTML) 11 Page - NXP Semiconductors |
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11 / 20 page ![]() BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 09 — 13 January 2010 11 of 20 NXP Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes 10. Soldering Dimensions in mm Fig 14. Reflow soldering footprint SOD323 (SC-76) Dimensions in mm Fig 15. Wave soldering footprint SOD323 (SC-76) Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 16. Reflow soldering footprint SOD523 (SC-79) msa433 1.65 0.50 (2 ×) 2.10 1.60 2.80 0.60 3.05 0.50 0.95 solder lands solder resist occupied area solder paste msa415 1.40 4.40 5.00 1.20 2.75 preferred transport direction during soldering solder lands solder resist occupied area mgs343 1.80 1.90 0.30 0.40 0.50 1.20 0.60 2.15 solder lands solder resist occupied area solder paste |
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