SE97TP datasheet(3/55 Pages) NXP

3 / 55 page

SE97_7

Product data sheet

Rev. 07 — 29 January 2010

3 of 55

NXP Semiconductors

SE97

DDR memory module temp sensor with integrated SPD, 3.3 V

Applications

DDR2 and DDR3 memory modules

Laptops, personal computers and servers

Enterprise networking

Hard disk drives and other PC peripherals

Ordering information

[1]

SE97TL and SE97TP offer improved VPOR/EVENT IOL.

[2]

Industry standard 2 mm

× 3mm × 0.8 mm package to JEDEC VCED-3 PSON8 in 8 mm × 4 mm pitch tape 4 k quantity reels.

[3]

SOT1069-1 is manufactured in APHK Hong Kong and SOT1069-2 is manufactured in APB Bangkok. The third line of the topside

marking will start with ‘P’ for SPHK and ‘n’ for APB.

Table 1.

Ordering information

Type number

Topside

mark

Package

Name

Description

Version

SE97PW

SE97

TSSOP8

plastic thin shrink small outline package; 8 leads;

body width 4.4 mm

SOT530-1

SE97TK

SE97

HVSON8

plastic thermal enhanced very thin small outline package;

no leads; 8 terminals; body 3

× 3 × 0.85 mm

SOT908-1

SE97TL[1]

97L

HXSON8

plastic thermal enhanced extremely thin small outline package;

no leads; 8 terminals; body 2

× 3 × 0.5 mm

SOT1052-1

SE97TP[1][2][3]

S97

HWSON8 plastic thermal enhanced very very thin small outline package;

no leads; 8 terminals; body 2

× 3 × 0.8 mm

SOT1069-1

SE97TP/S900[1][2][3]

S97

HWSON8 plastic thermal enhanced very very thin small outline package;

no leads; 8 terminals; body 2

× 3 × 0.8 mm

SOT1069-2

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