Encoder

Type

Potentiometer

Type

454

Hollow Shaft

Type Devices

Example of Reflow Soldering Condition

1. Heating method: Double heating method with infrared heater.

2. Temperature measurement: Thermocouple 0.1 to 0.2

φ CA（K）or CC（T）at soldering portion（copper foil surface）.A heat resisting tape

should be used for fixed measurement.

3. Temperature profile

300

200

100

A max.

B

E

D

Time (s)

C

Room

temperature

Pre-heating

F max.

Series

（Reflow type）

SRGP30

240

260

230

20

150

150

120

SRGP40

40

180

A

（℃）

Max

B

（℃）

C

（s）

D

（℃）

E

（℃）

F

（s）

1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where

the PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size,

thickness, etc. The above-stated conditions shall also apply to switch surface temperatures.

2. Soldering conditions differ depending on reflow soldering machines. You are requested to verify the soldering

conditions thoroughly beforehand.

Notes

Soldering Conditions

Hollow Shaft Type Devices