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Revision 1.02

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AS1970

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical

Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may

affect device reliability.

Table 3. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

7V

-0.3

+ 0.3

V

AS1970/AS1972/AS1974

-0.3

+ 0.3

V

AS1971/AS1973/AS1975

-0.3

+7

V

10

s

Continuous Power

Dissipation

5-pin SOT23

571

mW

Derate 7.1mW/ºC above +70ºC

8-pin MSOP

727

mW

Derate 9.1mW/ºC above +70ºC

14-pin TSSOP

727

mW

Derate 9.1mW/ºC above +70ºC

Operating Temperature Range

-40

+85

ºC

Junction Temperature Range

+150

ºC

Storage Temperature Range

-65

+150

ºC

Package Body Temperature

260

ºC

The reflow peak soldering temperature

(body temperature) specified is in

accordance with IPC/JEDEC J-STD-

020C “Moisture/Reflow Sensitivity

Classification for Non-Hermetic Solid

State Surface Mount Devices”.

The lead finish for Pb-free leaded

packages is matte tin (100% Sn).