ADP1870ARMZ-0.6-R7 datasheet(5/44 Pages) AD

5 / 44 page

ADP1870/ADP1871

Rev. 0 | Page 5 of 44

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

VREG to PGND, GND

−0.3 V to +6 V

VIN to PGND

−0.3 V to +28 V

FB, COMP/EN to GND

−0.3 V to (VREG + 0.3 V)

DRVL to PGND

−0.3 V to (VREG + 0.3 V)

SW to PGND

−2.0 V to +28 V

BST to SW

−0.6 V to (VREG + 0.3 V)

BST to PGND

−0.3 V to 28 V

DRVH to SW

−0.3 V to VREG

PGND to GND

±0.3 V

θJA (10-Lead MSOP)

2-Layer Board

213.1°C/W

4-Layer Board

171.7°C/W

Operating Junction Temperature

Range

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Soldering Conditions

JEDEC J-STD-020

Maximum Soldering Lead

Temperature (10 sec)

300°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Absolute maximum ratings apply individually only, not in

combination. Unless otherwise specified, all other voltages are

referenced to PGND.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 3. Thermal Resistance

Package Type

θJA1

Unit

θJA (10-Lead MSOP)

2-Layer Board

213.1

°C/W

4- Layer Board

171.7

°C/W

1 θJA is specified for the worst-case conditions; that is, θJA is specified for the

device soldered in a circuit board for surface-mount packages.

BOUNDARY CONDITION

In determining the values given in Table 2 and Table 3, natural

convection was used to transfer heat to a 4-layer evaluation board.

ESD CAUTION

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