Production Data

WM2331

WOLFSON MICROELECTRONICS LTD

PD Rev 1.4 April 2001

25

PACKAGE DIMENSIONS

NOTES:

A. ALL LINEAR DIMENSIONS ARE IN MILLIMETERS.

B. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.

C. BODY DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSION, NOT TO EXCEED 0.25MM.

D. MEETS JEDEC.95 MO-153, VARIATION = AE. REFER TO THIS SPECIFICATION FOR FURTHER DETAILS.

DM022.A

DT: 28 PIN TSSOP (9.7 x 4.4 x 1.0 mm)

Symbols

Dimensions

(mm)

MIN

NOM

MAX

A

-----

-----

1.20

0.05

-----

0.15

0.80

1.00

1.05

b

0.19

-----

0.30

c

0.09

-----

0.20

D

9.60

9.70

9.80

e

0.65 BSC

E

6.4 BSC

4.30

4.40

4.50

L

0.45

0.60

0.75

θ

0

o

-----

8

o

REF:

JEDEC.95, MO-153

θ

c

L

GAUGE

PLANE

0.25

15

28

E1

E

e

b

14

1

D

SEATING PLANE

A

A2

A1

-C-

0.1 C