74HC21_5

© NXP B.V. 2009. All rights reserved.

Product data sheet

Rev. 05 — 7 May 2009

11 of 14

NXP Semiconductors

74HC21

Dual 4-input AND gate

Fig 12. Package outline SOT402-1 (TSSOP14)

UNIT

(1)

QZ

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

0.15

0.05

0.95

0.80

0.30

0.19

0.2

0.1

5.1

4.9

4.5

4.3

0.65

6.6

6.2

0.4

0.3

0.72

0.38

8

0

o

o

0.13

0.1

0.2

1

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

0.75

0.50

SOT402-1

MO-153

99-12-27

03-02-18

D

Z

e

0.25

17

14

8

θ

A

Q

detail X

L

(A )

3

E

c

X

A

y

0

2.5

5 mm

scale

TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm

SOT402-1

A

max.

1.1

pin 1 index