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Motore di ricerca datesheet componenti elettronici |
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Motore di ricerca datesheet componenti elettronici |
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LPC2103 Scheda tecnica(PDF) 30 Page - NXP Semiconductors |
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LPC2103 Scheda tecnica(HTML) 30 Page - NXP Semiconductors |
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30 / 37 page  LPC2101_02_03_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 2 June 2009 30 of 37 NXP Semiconductors LPC2101/02/03 Single-chip 16-bit/32-bit microcontrollers 10.2 XTAL and RTC Printed Circuit Board (PCB) layout guidelines The crystal should be connected on the PCB as close as possible to the oscillator input and output pins of the chip. Take care that the load capacitors Cx1 and Cx2, and Cx3 in case of third overtone crystal usage, have a common ground plane. The external components must also be connected to the ground plain. Loops must be made as small as possible, in order to keep the noise coupled in via the PCB as small as possible. Also parasitics should stay as small as possible. Values of Cx1 and Cx2 should be chosen smaller accordingly to the increase in parasitics of the PCB layout. |
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