ABSOLUTE MAXIMUM RATINGS

(1)

THERMAL CHARACTERISTICS

(1)

ADS5474

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

SPECIFIED

PACKAGE

PACKAGE

ORDERING

TRANSPORT

PRODUCT

PACKAGE-LEAD

TEMPERATURE

DESIGNATOR

MARKING

NUMBER

MEDIA, QUANTITY

RANGE

ADS5474IPFP

Tray, 96

ADS5474

PFP

–40°C to +85°C

ADS5474I

PowerPAD

ADS5474IPFPR

Tape and Reel, 1000

(1)

For the most current product and ordering information see the Package Option Addendum located at the end of this document, or see

the TI web site at www.ti.com.

(2)

Thermal pad size: 6.15 mm × 6.15 mm (minimum), 7.5 mm × 7.5 mm (maximum).

Over operating free-air temperature range, unless otherwise noted.

ADS5474

UNIT

AVDD5 to GND

6

V

Supply voltage

AVDD3 to GND

5

V

DVDD3 to GND

5

V

Analog input to

Valid when supplies are on and within normal ranges. See additional

–0.3 to (AVDD5 + 0.3)

V

GND

information in the Power Supplies portion of the applications information

in the back of the datasheet regarding Clock and Analog Inputs when the

Clock input to GND

–0.3 to (AVDD5 + 0.3)

V

supplies are off.

CLK to CLK

±2.5

V

Digital data output to GND

–0.3 to (DVDD3 + 0.3)

V

Operating temperature range

–40 to +85

°C

Maximum junction temperature

+150

°C

Storage

–65 to +150

°C

temperature range

ESD, human-body

2

kV

model (HBM)

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied. Kirkendall voidings and current density information for calculation of expected lifetime are available upon

request.

PARAMETER

TEST CONDITIONS

TYP

UNIT

Soldered thermal pad, no airflow

23.7

(2)

Soldered thermal pad, 150-LFM airflow

17.8

°C/W

Soldered thermal pad, 250-LFM airflow

16.4

(3)

Bottom of package (thermal pad)

2.99

°C/W

(1)

Using 36 thermal vias (6 × 6 array). See PowerPAD Package in the Application Information section.

(2)

(3)

2

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