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ADP172ACBZ-2.1-R7 Scheda tecnica(PDF) 16 Page - Analog Devices |
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ADP172ACBZ-2.1-R7 Scheda tecnica(HTML) 16 Page - Analog Devices |
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16 / 20 page ![]() ADP172 Rev. B | Page 16 of 20 PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS Heat dissipation from the package can be improved by increasing the amount of copper attached to the pins of the ADP172. However, as can be seen from Table 6, a point of diminishing returns is eventually reached, beyond which an increase in the copper size does not yield significant heat dissipation benefits. Place the input capacitor as close as possible to the VIN and GND pins. Place the output capacitor as close as possible to the VOUT and GND pins. Use of 0402 or 0603 size capacitors and resistors achieves the smallest possible footprint solution for boards on which area is limited. Figure 37. Example ADP172 PCB Layout |
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