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Y

0

Y

1

SN74LVC1G19

1-OF-2 DECODER/DEMULTIPLEXER

SCES464E – JUNE 2003 – REVISED FEBRUARY 2007

ORDERING INFORMATION

ORDERABLE PART NUMBER

SN74LVC1G19YZPR

NanoFree™ – WCSP (DSBGA)

Reel of 3000

_ _ _CY_

0.23-mm Large Bump – YZP (Pb-free)

SN74LVC1G19YZPRB

SON – DRY

Reel of 4000

SN74LVC1G19DRYR

CY_

SN74LVC1G19DBVR

SOT (SOT-23) – DBV

Reel of 3000

CY_

SN74LVC1G19DBVRE4

–40

°C to 85°C

SN74LVC1G19DCKR

SOT (SC-70) – DCK

Reel of 3000

SN74LVC1G19DCKRE4

CY_

SN74LVC1G19DCKRG4

SN74LVC1G19DRLR

SOT (SOT-553) – DRL

Reel of 4000

CY_

SN74LVC1G19DRLRG4

(1)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2)

DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the assembly/test site.

YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,

• = Pb-free).

FUNCTION TABLE

INPUTS

OUTPUTS

E

A

L

L

L

H

L

H

H

L

H

X

H

H

LOGIC DIAGRAM (POSITIVE LOGIC)

2

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