STM32F101X8 datasheet(72/85 Pages) STMICROELECTRONICS

Il numero della parte	STM32F101X8

Spiegazioni elettronici	Medium-density access line, ARM-based 32-bit MCU with 64 or 128 KB Flash, 6 timers, ADC and 7 communication interfaces

PDF	85 Pages

Scroll/Zoom	100%

Produttore elettronici	STMICROELECTRONICS [STMicroelectronics]

Homepage	http://www.st.com

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72 / 85 page

Package characteristics

STM32F101x8, STM32F101xB

72/85

Doc ID 13586 Rev 13

Drawing is not to scale.

The back-side pad is not internally connected to the VSS or VDD power pads.

There is an exposed die pad on the underside of the VFQFPN package. It should be soldered to the PCB. All leads should

also be soldered to the PCB.

Figure 39.

VFQFPN36 6 x 6 mm, 0.5 mm pitch, package

outline(1)

Figure 40.

Recommended footprint

(dimensions in mm)(1)(2)(3)

Seating plane

ddd

Pin # 1 ID

R = 0.20

ZR_ME

0.30

6.30

0.50

1.00

4.30

4.80

4.10

ai14870b

0.75

Table 47.

VFQFPN36 6 x 6 mm, 0.5 mm pitch, package mechanical data

Symbol

millimeters

inches(1)

Min

Typ

Max

Min

Typ

Max

0.800

0.900

1.000

0.0315

0.0354

0.0394

0.020

0.050

0.0008

0.0020

0.650

1.000

0.0256

0.0394

0.250

0.0098

0.180

0.230

0.300

0.0071

0.0091

0.0118

5.875

6.000

6.125

0.2313

0.2362

0.2411

1.750

3.700

4.250

0.0689

0.1457

0.1673

5.875

6.000

6.125

0.2313

0.2362

0.2411

1.750

3.700

4.250

0.0689

0.1457

0.1673

0.450

0.500

0.550

0.0177

0.0197

0.0217

0.350

0.550

0.750

0.0138

0.0217

0.0295

ddd

0.080

0.0031

Values in inches are converted from mm and rounded to 4 decimal digits.

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