iC-DI

DUAL SENSOR INTERFACE

Rev C2, Page 3/15

PACKAGES QFN24 4 mm x 4 mm to JEDEC Standard

PIN CONFIGURATION QFN24 4 mm x 4 mm

7

8

9

10

11

1

2

3

4

5

13

14

15

21

22

6

12

16

17

19

20

18

23

24

DI

code...

...

PIN FUNCTIONS

No. Name Function

1 ISET

Reference Current for current limitation

of driver outputs

2 INV1

Inverting Input Channel 1

3 IN1

Input Channel 1

PIN FUNCTIONS

No. Name

Function

4 QCFG1 Configuration Input Channel 1

5 QCFG2 Configuration Input Channel 2

6 IN2

Input Channel 2

7 OEN

Output Enable Input

8 NOVL

Overload Error Output

9 NUVD

Undervoltage Error Output

10 CFO

Output Feedback Channel

11 CFP

Configuration Input Feedback Channel

12 CFI

Input Feedback Channel

13 QP2

Output High Side Switch Channel 2

14 QN2

Output Low Side Switch Channel 2

15 VN

Reference Voltage Low Side Switch

16 QN1

Output Low Side Switch Channel 1

17 QP1

Output High Side Switch Channel 1

18 VBO

Reference Voltage High Side Switch

19 VBR

Power Supply switching converter and

linear regulators

20 VHL

Inductor Switching Converter

21 VH

Input Linear Regulators

22 VCC

5 V Sensor Supply

23 VCC3

3.3 V Sensor Supply

24 GND

Ground

Pins GND and VN must not be externally connected, otherwise with reverse bias intolerably high current

may flow!

The Thermal Pad is to be connected to a Ground Plane (VN) on the PCB.

Only pin 1 marking on top or bottom defines the package orientation (iC-DI label and coding is subject

to change).