MBRM360 datasheet(3/4 Pages) DIODES

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DS30355 Rev. 5 - 2

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MBRM360

NOT RECOMMENDED FOR NEW DESIGN

USE PDS360

0.5

1.5

2.5

3.5

100

125

150

T , AMBIENT TEMPERATURE (°C)

Fig. 5 DC Forward Current Derating

, AVERAGE FORWARD CURRENT (A)

Fig. 6 Forward Power Dissipation

F(AV)

Notes:

TA = TSOLDERING POINT, RθJS = 3.2°C/W, RθSA = 0°C/W.

Device mounted on GETEK substrate, 2”x2”, 2 oz. copper, double-sided, cathode pad dimensions 0.75” x 1.0”, anode pad

dimensions 0.25” x 1.0”. RθJA in range of 20-40°C/W.

Device mounted on FR-4 substrate, 2”x2”, 2 oz. copper, single-sided, pad layout as per Diodes Inc. suggested pad layout

document AP02001 which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. RθJA in range of

100-120°C/W.

Maximum power dissipation when the device is mounted in accordance to the conditions described in Note 4.

Maximum power dissipation when the device is mounted in accordance to the conditions described in Note 5.

Ordering Information (Note 8)

Device

Packaging

Shipping

MBRM360-13-F

POWERMITE

®3

5000/Tape & Reel

Notes:

8. For Packaging Details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.

Marking Information

MBRM360 = Product type marking code

= Manufacturers’ code marking

YYWW = Date code marking

YY = Last digit of year (ex: 02 for 2002)

WW = Week code (01 to 53)

(K) = Factory Designator

YYWW(K)

MBRM360

MBRM360 Scheda tecnica(PDF) 3 Page - Diodes Incorporated

MBRM360 Scheda tecnica(HTML) 3 Page - Diodes Incorporated

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Scheda tecnica Scarica

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