101

©2009 Littelfuse, Inc.

Specifications are subject to change without notice.

Please refer to http://www.littelfuse.com for current information.

Low Capacitance TVS protection for high-speed data interfaces

SP03-3.3 (SO-8) Series

Part Numbering System

Product Characteristics

Ordering Information

.

y

t

Q

r

e

d

r

O

.

n

i

M

g

n

i

k

r

a

M

e

g

a

k

c

a

P

r

e

b

m

u

N

t

r

a

P

2500

Lead Plating

Matte Tin

Lead Material

Copper Alloy

Lead Coplanarity

0.004 inches (0.102mm)

Subsitute Material

Silicon

Body Material

Flammability

SP XX XX X T G

Silicon

Protection Array

Series

Working

Voltage

Package

T= Tape & Reel

G= Green

Part Marking System

Package Dimensions - Mechanical Drawings and Recommended Solder Pad Outline

Package

MS-012 (SO-8)

8

s

n

i

P

JEDEC

MO-223 Issue A

Millimetres

Inches

Min

Max

Min

Max

A

1.35

1.75

0.053

A1

0.10

0.25

0.004

0.010

A2

1.25

1.65

0.043

0.065

B

0.31

0.51

0.012

0.020

c

0.017

0.25

0.007

0.010

D

4.80

5.00

E

5.80

6.20

0.228

0.244

E1

3.80

4.00

0.150

0.157

e

1.27 BSC

0.050 BSC

L

0.40

1.27

0.016

0.050

o

Recommended

Soldering Pad Outline

(Reference Only)

F

L

First Line: Part number

Second Line: Date code

F

XXXXXXXX

Notes :

1. All dimensions are in millimeters

2. Dimensions include solder plating.

5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.

SPA Silicon Protection Arrays

TM