Analog Integrated Circuit Device Data

Freescale Semiconductor

7

33984

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

THERMAL RATINGS

Operating Temperature

Ambient

Junction

-40 to 125

-40 to 150

Storage Temperature

-55 to 150

Thermal Resistance(5)

Junction-to-Case

Junction-to-Ambient

<1.0

30

Peak Package Reflow Temperature During Reflow(6), (7)

Note 7

°C

Notes

5.

Device mounted on a 2s2p test board according to JEDEC JESD51-2.

6.

Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

7.

Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes

and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.

Table 3. Maximum Ratings

All voltages are with respect to ground unless otherwise noted.

Rating

Symbol

Value

Unit