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MCP652 Scheda tecnica(PDF) 33 Page - Microchip Technology |
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MCP652 Scheda tecnica(HTML) 33 Page - Microchip Technology |
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33 / 56 page ![]() © 2011 Microchip Technology Inc. DS22146B-page 33 MCP651/2/4/5/9 6.0 PACKAGING INFORMATION 6.1 Package Marking Information Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e 8-Lead SOIC (150 mil) (MCP651, MCP652) Example : XXXXXXXX XXXXYYWW NNN MCP651E SN 1105 256 3 e 8-Lead DFN (3x3) (MCP652) Example: XXXX YYWW NNN DABP 1105 256 Device Code MCP652 DABP Note: Applies to 8-Lead 3x3 DFN 10-Lead DFN (3x3) (MCP655) 10-Lead MSOP (MCP655) Example: XXXXXX YWWNNN 655EUN 105256 Example: XXXX YYWW NNN BAFC 1105 256 |
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