DIP Switches

SMT Half Pitch Type DIP Switches

DX48 Series

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5

5.

SOLDERING CONDITIONS:

Condition for Soldering

The condition mentioned above is the temperature on the Cu foil of the PCB surface.

There are cases where board's temperature greatly differs from switch's surface

temperature depending on board's material, size, thickness, etc.

Care, therefore,

should be used not to allow switch's surface temperature to exceed 260

.

Temperature

Room

150°

MAX 260°

60sec

120~150sec

TIME(sec)

255°

230°

5~10sec

Manual Soldering

Max,350

Soldering Temperature

Continuous Soldering Time

Max,5 seconds

Precautions in Handling

1. Care should be exercised so that flux from the upper part of the printed circuit board

does not adhere to the switch.

cleaning method from top of s/w.

Z axial direction with in 30°~120°of max 300 gf / 10

sec operation.

30°~12

4. The suggest tool for actuator adjust is as below. ( example for 4 position )