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TS3DDR3812 Scheda tecnica(PDF) 2 Page - Texas Instruments |
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TS3DDR3812 Scheda tecnica(HTML) 2 Page - Texas Instruments |
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2 / 18 page ![]() B0 B1 B2 B3 B4 B5 C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 C10 C11 A 0 A 1 A 2 A 3 A 4 A 5 SEL1 Control Logic SEL2 B6 B7 B8 B9 B10 B11 A 6 A 7 A 8 A 9 A 10 A 11 EN TS3DDR3812 SCDS314A – FEBRUARY 2011 – REVISED MARCH 2011 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION TA PACKAGE(1) ORDERABLE PART NUMBER TOP-SIDE MARKING –40°C to 85°C QFN - RUA Tape and Reel TS3DDR3812RUAR SL812 (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. LOGIC DIAGRAM FUNCTION TABLE EN SEL1 SEL2 FUNCTION L X X A0 to A11, B0 to B11, and C0 to C11 are Hi-Z H L L A0 to A5 = B0 to B5 and A6 to A11 = B6 to B11 H L H A0 to A5 = B0 to B5 and A6 to A11 = C6 to C11 H H L A0 to A5 = C0 to C5 and A6 to A11 = B6 to B11 H H H A0 to A5 = C0 to C5 and A6 to A11 = C6 to C11 2 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s) :TS3DDR3812 |
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