4

4 - 63

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

Outline Drawing

Absolute Maximum Ratings

NOTES:

1. ALL DIMENSIONS ARE IN INCHES [MM].

2. DIE THICKNESS IS .004”.

3. TYPICAL BOND PAD IS .004” SQUARE.

4. BOND PAD SPACING CENTER TO CENTER IS .006”.

5. BACKSIDE METALLIZATION: GOLD.

6. BOND PAD METALLIZATION: GOLD.

7. BACKSIDE METAL IS GROUND.

8. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.

9. THIS DIE IS DESIGNED FOR PICK-UP WITH VACUUM (EDGE)

COLLET TOOLS. TO PRECLUDE THE RISK OF PERMANENT

DAMAGE, NO CONTACT TO THE DIE SURFACE IS ALLOWED

WITHIN THIS RECTANGULAR AREA.

Standard

Alternate

WP-7 (Waffle Pack)

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

RF / IF Input

+25 dBm

LO Drive

+25 dBm

Channel Temperature

150 °C

Continuous Pdiss (T = 85 °C)

(derate 3.26 mW/°C above 85 °C)

212 mW

Thermal Resistance

(channel to die bottom)

306 °C/W

Storage Temperature

-65 to +150 °C

Operating Temperature

-55 to +85 °C

ESD Sensitivity (HBM)

Class 1C

HMC554

v02.1007

GaAs MMIC FUNDAMENTAL

MIXER, 11 - 20 GHz