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KMA200 Scheda tecnica(PDF) 28 Page - NXP Semiconductors |
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KMA200 Scheda tecnica(HTML) 28 Page - NXP Semiconductors |
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28 / 33 page ![]() KMA200 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 8 — 7 December 2011 28 of 33 NXP Semiconductors KMA200 Programmable angle sensor 18. Package outline Fig 13. Package outline SOT637 UNIT bp c v L2 min. REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 1.65 1.45 0.41 0.34 bp1 1.57 1.47 bp2 0.31 0.24 8.1 7.9 4.1 3.9 0.30 0.24 4.75 E1 L1 0.5 45 ° L 7.1 6.9 0.85 0.75 L3 0.7 0.5 DD1 2.55 0.35 D2 D3 (1) max. 0.2 R max. 0.95 L4 (1) max. 5.45 5.25 E 0.85 0.65 F 3.275 3.075 F1 1.27 21.4 21.0 HE 6.42 6.32 5.85 HE1 HE2 max. e 1.2 Q1 0.65 0.55 DIMENSIONS (mm are the original dimensions) SOT637 02-01-18 04-12-10 0 2.5 5 mm scale A e E D2 F D3(1) D3(1) HE1 HE2 F1 L1 L bp1 D R D1 L3 L4(1) HE E1 Note 1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic between and besides the leads. L2 bp bp2 c 123 4 5 Q1 Q1 A A SOT637 Plastic single-ended multi-chip package; 6 interconnections; 5 in-line leads α α SENSOR DIE POSITION * centre of reading point B A view A-B A 0.4 vA |
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