2008. 7. 3

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TL431 Series

Revision No : 0

PRECAUTION FOR USE

Lead-Free Soldering Condition.

Elements mounting styles of electronic devices are gaining in further diversification over recent years, and needs for

components are all the more expanding in varieties. Especially, surface mounting is steadily penetrating into industrial

segments as a world-wide popular technical trend. Although exposure to high temperature is inevitable during soldering

we recommend limiting the soldering temperature to low levels as shown in figure for the sake of retaining inherent

excellent reliability.

1. When employing solder reflow method

1) Soldering Condition

Standard Condition : 250

(Temperature), 10

1sec. (Time)

Peak Condition : 260

3

2) Recommend temperature profile

3) Precautions on heating method

When resin in kept exposed to high temperature for a long time, device reliability may be marred.

Therefore, it is essential to complete soldering in the shortest time possible to prevent temperature of resin from rising.

2. When employing halogen lamps or infrared-ray heaters

When halogen lamps or infrared-ray heaters are used, avoid direct irradiation onto resin surfaces; such devices

cause extensive localized temperature rise.

Please keep a reflow solder operating when Surface Mount Package s Soldering.

Time (sec)

150 C

180 C

Peak : 260 3 C

230 C

250 C

+

_

Preheating Zone

90 30sec

+

_

Reflow Zone

35 5sec

+

_

10 1sec

+

_

[Lead-Free Soldering Temperature Profile]