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MIC2753 Scheda tecnica(PDF) 4 Page - Micrel Semiconductor

Il numero della parte MIC2753
Spiegazioni elettronici  Power Supply Supervisors
PDF  12 Pages
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Produttore elettronici  MICREL [Micrel Semiconductor]
Homepage  http://www.micrel.com
Logo MICREL - Micrel Semiconductor

MIC2753 Scheda tecnica(HTML) 4 Page - Micrel Semiconductor

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MIC2753/2754
Micrel
MIC2753/2754
4
June 1999
Symbol
Parameter
Condition
Min
Typ
Max
Units
V
OL(RST)
Reset Output Voltage Low
R/S/T voltage codes,
0.5
V
MIC2753
V
IN = VTHU(max) + 100mV, ISINK = 50µA
L/M voltage codes,
0.5
V
V
IN = VTHU(max) + 100mV, ISINK = 50µA
V
OH(RST)
Reset Output Voltage High
R/S/T voltage codes,
V
IN –0.5
V
MIC2753
V
IN = VTHU(min) – 100mV, ISOURCE = 0.5mA
L/M voltage codes,
V
IN –0.8
V
V
IN = VTHU(min) – 100mV, ISOURCE = 1.0mA
V
OL(RST)
/Reset Output Voltage Low
R/S/T voltage codes,
0.5
V
MIC2754
V
IN = VTHU(min) – 100mV, ISINK = 0.5mA
L/M voltage codes,
0.8
V
V
IN = VTHU(min) – 100mV, ISINK = 1.0mA
V
IN ≥ 1.5V, IOL = 50µA
0.5
V
V
OH(RST)
/Reset Output Voltage High
R/S/T voltage codes,
V
IN –0.5
V
MIC2754
V
IN = VTHU(max) + 100mV, ISOURCE = 35µA
L/M voltage codes,
V
IN –0.5
V
V
IN = VTHU(max) + 100mV, ISOURCE = 35µA
V
IH(/MR)
/MR Input Voltage, High
0.8 V
IN
V
V
IL(/MR)
/MR Input Voltage, Low
0.2 V
IN
V
t
PROP(/MR)
Propagation Delay
V
/MR ≤ VIL to VRST ≥ VOH
1
2
µs
MIC2753
Propagation Delay
V
/MR ≤ VIL to V/RST ≤ VOL
1
2
µs
MIC2754
t
/MR(min)
/MR Minimum Input Pulse Width
2.5
µs
I
PU
Pull-Up Current, /MR
V
/MR = 0V
0.2
2
µA
I
IH
Input Current, /MR
V
/MR = VIN
0.01
µA
V
OL(/HV)
/HV Output Voltage Low
V
IN > VTHO(max),
0.5
V
I
SINK = 0.5mA, R/S/T voltage codes
V
V
IN > VTHO(max),
0.8
V
I
SINK = 1.0mA, L/M voltage codes
V
t
PROP(/HV)
/HV Propagation Delay
V
IN = VTHO (min) – 100mV to VTHO (max) + 100mV
12
30
µs
I
/HV
/HV Leakage Current
V
IN = VTHO (min) – 100mV
–2+2
µA
Note 1.
Exceeding the absolute maximum rating may damage the device.
Note 2.
The device is not guaranteed to function outside its operating rating.
Note 3.
Devices are ESD sensitive. Handling precautions recommended.
Note 4.
Final test on outgoing product is performed at T
A = 25°C. Device performance over –40°C ≤ TA ≤ +85°C is guaranteed by design.



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