CPC1786 datasheet(1/7 Pages) CLARE

Il numero della parte	CPC1786

Spiegazioni elettronici	i4-PAC??DC Power Relay

PDF	7 Pages

Scroll/Zoom	100%

Produttore elettronici	CLARE [Clare, Inc.]

Homepage	http://www.clare.com

Logo

1 / 7 page

DS-CPC1786 - R05

www.clare.com

1

e3

RoHS

2002/95/EC

Characteristics

Features

• 1.75A

DC Load Current with 5°C/W Heat Sink

• Low 2

Ω On-Resistance

• 1000V

P Blocking Voltage

• 2500V

rms Input/Output Isolation

• Low Thermal Resistance (0.35 °C/W)

• Electrically Non-conductive Thermal Pad for Heat

Sink Applications

• Low Drive Power Requirements

• Arc-Free With No Snubbing Circuits

• No EMI/RFI Generation

• Machine Insertable, Wave Solderable

Applications

• Industrial Controls / Motor Control

• Robotics

• Medical Equipment—Patient/Equipment Isolation

• Instrumentation

• Multiplexers

• Data Acquisition

• Electronic Switching

• I/O Subsystems

• Meters (Watt-Hour, Water, Gas)

• Transportation Equipment

• Aerospace/Defense

Approvals

• UL 508 Certified Component: File E69938

Pin Configuration

Description

Clare and IXYS have combined to bring OptoMOS®

technology, reliability and compact size to a new family

of High Power Solid State Relays. As part of this new

family, the CPC1786 single-pole normally open

(1-Form-A) DC Solid State Relay employs optically

coupled MOSFET technology to provide 2500Vrms of

input to output isolation.

The output, constructed with an efficient MOSFET

switch and photovoltaic die, uses Clare’s patented

OptoMOS architecture while the input, a GaAlAs

infrared LED, provides the optically coupled control.

The combination of low on-resistance and high load

current handling capability makes this relay suitable

for a variety of high performance DC switching

applications.

The unique i4-PAC package pioneered by IXYS

enables solid state relays to achieve the highest load

current and power ratings. This package features an

IXYS unique process where the silicon chips are soft

soldered onto the Direct Copper Bond (DCB)

substrate instead of the usual copper leadframe. The

DCB ceramic, the same substrate used in high power

modules, not only provides 2500Vrms isolation but also

very low thermal resistance (0.35°C/W).

Ordering Information

Switching Characteristics

Parameter

Rating

Units

Blocking Voltage

1000

VP

Load Current, TA=25°C:

With 5°C/W Heat Sink

1.75

ADC

No Heat Sink

0.65

On-Resistance

2

Ω

RθJC

0.35

°C/W

12

3

4

+-

-

+

Part

Description

CPC1786J

i4-PAC Package (25 per tube)

Form-A

I

F

I

LOAD

10%

90%

t

on

t

off

CPC1786

Single-Pole, Normally Open

i4-PAC™ DC Power Relay

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