CPC1927 datasheet(3/7 Pages) CLARE

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PRELIMINARY

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R03

CPC1927

Thermal Characteristics

2.1 Thermal Management

Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal interface

material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate junction-to-ambient

thermal resistance of 12.5°C/W.

2.2 Heat Sink Calculation

Higher load currents are possible by using lower thermal resistance heat sink combinations.

Parameter

Conditions

Symbol

Minimum

Typical

Maximum

Units

Thermal Resistance (Junction to Case)

RθJC

0.3

°C/W

Thermal Resistance (Junction to Ambient)

Free Air

RθJA

-33-

°C/W

Junction Temperature (Operating)

-40

100

°C

J = Junction Temperature (°C), TJ ≤ 100°C *

A = Ambient Temperature (°C)

L(99) = Load Current with Case Temperature @ 99°C (ADC)

L = Desired Operating Load Current (ADC), IL ≤ IL(MAX)

θJC = Thermal Resistance, Junction to Case (°C/W) = 0.3°C/W

θCA = Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W)

D(99) = Maximum power dissipation with case temperature held at 99ºC = 3.33W

* Elevated junction temperature reduces semiconductor lifetime.

Heat Sink Rating

θCA =

- R

θJC

J - TA) IL(99)

•

D(99)

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