Data Sheet

ADMP521

Rev. A | Page 13 of 16

HANDLING INSTRUCTIONS

PICK-AND-PLACE EQUIPMENT

The MEMS microphone can be handled using standard pick-and-

place and chip shooting equipment. Take care to avoid damage to

the MEMS microphone structure as follows:

•

Use a standard pickup tool to handle the microphone.

Because the microphone hole is on the bottom of the

package, the pickup tool can make contact with any part

of the lid surface.

•

Use care during pick-and-place to ensure that no high shock

events above 10 kg are experienced because such events

may cause damage to the microphone.

•

Do not pick up the microphone with a vacuum tool that

makes contact with the bottom side of the microphone.

Do not pull air out of or blow air into the microphone port.

•

Do not use excessive force to place the microphone on

the PCB.

REFLOW SOLDER

For best results, the soldering profile should be in accordance with

the recommendations of the manufacturer of the solder paste used

to attach the MEMS microphone to the PCB. It is recommended

that the solder reflow profile not exceed the limit conditions

specified in Figure 4 and Table 4.

BOARD WASH

When washing the PCB, ensure that water does not make contact

with the microphone port. Do not use blow-off procedures and

ultrasonic cleaning.