ADP7104ACPZ-2.5-R7 datasheet(22/28 Pages) AD

Il numero della parte	ADP7104ACPZ-2.5-R7

Spiegazioni elettronici	20 V, 500 mA, Low Noise, CMOS LDO

PDF	28 Pages

Scroll/Zoom	100%

Produttore elettronici	AD [Analog Devices]

Homepage	http://www.analog.com

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22 / 28 page

ADP7104

Data Sheet

Rev. B | Page 22 of 28

In the case where the board temperature is known, use the

thermal characterization parameter, ΨJB, to estimate the

junction temperature rise (see Figure 76 and Figure 77).

Maximum junction temperature (TJ) is calculated from

the board temperature (TB) and power dissipation (PD)

using the following formula:

TJ = TB + (PD × ΨJB)

(5)

The typical value of ΨJB is 15.1°C/W for the 8-lead LFCSP package

and 31.3°C/W for the 8-lead SOIC package.

TOTAL POWER DISSIPATION (W)

100

120

140

0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0

TB = 25°C

TB = 50°C

TB = 65°C

TB = 85°C

TJ MAX

Figure 76. LFCSP

TOTAL POWER DISSIPATION (W)

100

120

140

0.5

1.0

1.5

2.0

2.5

3.0

3.5

TB = 25°C

TB = 50°C

TB = 65°C

TB = 85°C

TJ MAX

Figure 77. SOIC

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