ADP2164ACPZ-3.3-R7 datasheet(19/20 Pages) AD

19 / 20 page

Data Sheet

ADP2164

Rev. 0 | Page 19 of 20

OUTLINE DIMENSIONS

COMPLIANT

TO JEDEC STANDARDS MO-220-WGGC.

0.65

BSC

BOTTOM VIEW

TOP VIEW

EXPOSED

PAD

PIN 1

INDICATOR

4.10

4.00 SQ

3.90

0.50

0.40

0.30

SEATING

PLANE

0.80

0.75

0.70

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

PIN 1

INDICATOR

0.35

0.30

0.25

2.60

2.50 SQ

2.40

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 48. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

4 mm × 4 mm Body, Very Very Thin Quad

(CP-16-26)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Output Voltage

Package Description

Package Option

ADP2164ACPZ-R7

−40°C to +125°C

Adjustable

16-Lead LFCSP_WQ

CP-16-26

ADP2164ACPZ-1.0-R7

−40°C to +125°C

1.0 V

16-Lead LFCSP_WQ

CP-16-26

ADP2164ACPZ-1.2-R7

−40°C to +125°C

1.2 V

16-Lead LFCSP_WQ

CP-16-26

ADP2164ACPZ-1.5-R7

−40°C to +125°C

1.5 V

16-Lead LFCSP_WQ

CP-16-26

ADP2164ACPZ-1.8-R7

−40°C to +125°C

1.8 V

16-Lead LFCSP_WQ

CP-16-26

ADP2164ACPZ-2.5-R7

−40°C to +125°C

2.5 V

16-Lead LFCSP_WQ

CP-16-26

ADP2164ACPZ-3.3-R7

−40°C to +125°C

3.3 V

16-Lead LFCSP_WQ

CP-16-26

ADP2164-EVALZ

Evaluation Board

1 Z = RoHS Compliant Part.

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