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STPS8L30DEE Scheda tecnica(PDF) 4 Page - STMicroelectronics |
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STPS8L30DEE Scheda tecnica(HTML) 4 Page - STMicroelectronics |
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4 / 8 page ![]() Characteristics STPS8L30DEE 4/8 Doc ID 023251 Rev 1 Figure 7. Forward voltage drop versus forward current Figure 8. Thermal resistance junction to ambient versus copper surface under tab IFM(A) 0.1 1.0 10.0 100.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 VFM(V) Tj=25 °C (Maximum values) Tj=125 °C (Typical values) Tj=125 °C (Maximum values) Rth(j-a)(°C/W) 0 50 100 150 200 250 01 2345 678 9 10 PowerFLAT (3.3x3.3) SCu(cm²) epoxy printed board FR4, copper thickness=35µm |
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