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STPS30M60DJF Scheda tecnica(PDF) 4 Page - STMicroelectronics |
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STPS30M60DJF Scheda tecnica(HTML) 4 Page - STMicroelectronics |
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4 / 8 page ![]() Characteristics STPS30M60DJF 4/8 Doc ID 023120 Rev 1 Figure 11. Reverse safe operating area (tp < 1 µs and Tj < 150 °C) Figure 7. Reverse leakage current versus reverse voltage applied (typical values) Figure 8. Junction capacitance versus reverse voltage applied (typical values) Figure 9. Forward voltage drop versus forward current Figure 10. Thermal resistance junction to ambient versus copper surface under tab 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 0 5 10 15 20 25 30 35 40 45 50 55 60 T = 25 °C j T = 50 °C j T = 75 °C j T = 125 °C j T = 150 °C j T = 100 °C j I (mA) R V (V) R 100 1000 10000 1 10 100 F = 1 MHz V = 30 mV T = 25 °C osc RMS j C(pF) V (V) R I (A) FM 0.1 1.0 10.0 100.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 T = 125 °C (Maximum values) j V (V) FM T = 25 °C (Maximum values) j T = 125 °C (Typical values) j 0 50 100 150 200 250 01 23 45 67 8 9 10 R (°C/W) th(j-a) S (cm²) cu epoxy printed board FR4, copper thickness = 35 µm I (A) arm 5 10 15 20 60 65 70 75 80 85 90 95 100 105 110 Varm |
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