Characteristics

STPS1545C

4/10

Doc ID 3503 Rev 7

Figure 11.

Thermal resistance junction to ambient versus copper surface under tab (DPAK)

Figure 7.

Reverse leakage current versus

reverse voltage applied (typical

values, per diode)

Figure 8.

Junction capacitance versus

reverse voltage applied (typical

values, per diode)

0

5

10

15

20

25

30

35

40

45

1E-1

1E+0

1E+1

1E+2

1E+3

1E+4

5E+4

I (µA)

R

V (V)

R

T =125°C

j

T =150°C

j

T =100°C

j

T =25°C

j

T =50°C

j

T =75°C

j

12

5

10

20

50

100

200

500

1000

C(pF)

V (V)

R

F=1MHz

V

=30mV

T =25°C

OSC

RMS

j

Figure 9.

Forward voltage drop versus

forward current (high values, per

diode)

Figure 10.

Thermal resistance junction to

ambient versus copper surface

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

0.1

1.0

10.0

100.0

I

(A)

FM

T =125°C

(typical values)

j

T =25°C

maximum values

j

T =125°C

maximum values

j

V

(V)

FM

0

10

20

30

40

50

60

70

80

0

5

10

15

20

25

30

35

40

D²PAK

Epoxy printed circuit board

copper thickness = 35 µm

R

(°C/W)

th(j-a)

S (cm²)

cu

0

10

20

30

40

50

60

70

80

90

100

0

5

10

15

20

25

30

35

40

DPAK

Epoxy printed circuit board

copper thickness = 35 µm

R

(°C/W)

th(j-a)

S (cm²)

cu