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STPS8170DEE Scheda tecnica(PDF) 4 Page - STMicroelectronics |
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STPS8170DEE Scheda tecnica(HTML) 4 Page - STMicroelectronics |
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4 / 8 page ![]() Characteristics STPS8170DEE 4/8 Doc ID 023260 Rev 1 Figure 7. Forward voltage drop versus forward current Figure 8. Thermal resistance junction to ambient versus copper surface under tab IFM(A) 0.1 1.0 10.0 100.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 VFM(V) Tj=25 °C (Maximum values) Tj=125 °C (Maximum values) Tj=125 °C (Typical values) Rth(j-a)(°C/W) 0 50 100 150 200 250 01 2345 678 9 10 PowerFLAT (3.3x3.3) SCu(cm²) epoxy printed board FR4, copper thickness=35µm |
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